At SEMICON West 2026, taking place from October 13-15, 2026, at the Moscone Center in Phoenix, San francisco, CA, Besi is excited to showcase our latest advancements in semiconductor assembly equipment.

Join Besi at SEMICON West 2026 to explore our cutting-edge technologies designed to meet the evolving demands of the semiconductor industry. Our comprehensive suite of equipment includes:

• Die Attach Equipment: High-precision systems for various bonding applications.

• Packaging Equipment: Advanced solutions for molding, trim & form, and singulation processes.

• Plating & Cleaning Equipment: State-of-the-art systems ensuring optimal performance and reliability.
    

San Francisco CA, USA | October 13-15, 2026 

https://www.semiconwest.org

We look forward to connecting with you at SEMICON West 2026!