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Die Attach
Multi Module Attach
Datacon 2200 evo
Datacon 2200 evo
plus
Datacon 2200 evo
hF
Datacon 2200 evo
hS
Datacon 2200 evo
advanced
Die Bonding
Esec 2100 hS
ix
Esec 2100 sD
advanced
i
Esec 2100 hS
i
Esec 2100 hS
Esec 2100 SC
Strip Mapping E142 on Esec Die Bonder
Soft Solder Die Bonding
Esec 2009 SSI
E
Esec 2009 fS
E
Flip Chip
Datacon 8800 FC QUANTUM
hS
Datacon 8800 TC
advanced
Datacon 8800 FC QUANTUM
advanced
Datacon 8800 CHAMEO
advanced
Esec 2100 FC hS
Packaging
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AMS-X
MMS-X
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Fico AMS-LM Top Foil
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Fico MMS-LM Top Foil
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Fico MMS-i
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Fico Compact Line - X
Fico Compact Line - P
Singulation
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Leadframe wet processing
Meco CDL 1500
Meco FXL
Leadframe Plating
Meco ACP
Meco RTR Ag
Meco EDF/EPL
Connector Plating
Meco Connector Plating
Solar Plating
Meco DPL
Meco PPL
Meco RTR Solar
Meco CPL
Film and Foil Plating
Meco FAP
Chemistry and Tooling
Mecodeflash 100
Surclean 201 - 204
Mecorinse 500
Mecostrip Au 2
Mecostrip Ag-ID 1(Alt)
Meco EPL 4
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AGM 2024
Archive AGM 2023
Archive AGM 2022
Archive AGM 2021
Archive AGM 2020
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A Career at Besi
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Euronext Tech Leaders Campus
Press Releases
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Financial Reports and Publications
Financial Calendar
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Annual General Meeting
Share Information
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Corporate Governance
Request for Information
Financial Calendar
21 Nov 2023
Euronext Tech Leaders Campus
(Paris, France)
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