According to Applied’s press release, Applied views its investment in Besi as long-term. Applied does not intend to seek board representation at Besi, nor does it currently have plans to purchase additional shares of Besi.

Besi and Applied have collaborated together since 2020 on the development and commercialization of integrated hybrid bonding production systems for leading semiconductor manufacturers. The collaboration brings together Applied’s expertise in front-end manufacturing and Besi’s leading technologies in die placement, interconnect and assembly solutions. Recently, the companies have expanded their collaboration with Besi joining Applied’s EPIC Center as an Innovation Partner. Areas of collaboration target next-generation 3D IC scaling, logic and memory integration, the scaling of thermo-compression bonding and new die-on-wafer, die-on-die and die-on-panel integration platforms.

Richard W. Blickman, Besi’s Chief Executive Officer, commented:
“We welcome Applied’s increased strategic investment as further confirmation of Besi’s hybrid bonding and wafer-level assembly strategy. It also highlights future areas of potential collaboration between the companies targeting next generation AI and photonics systems for the industry’s leading customers.”

For the full press release, please download the PDF file.