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Press Releases

09 May 2024

BE Semiconductor Industries N.V. Announces Order for 26 Hybrid Bonding Systems

Duiven, the Netherlands, May 9, 2024 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the receipt of an order for 26 hybrid bonding systems from a leading semiconductor logic manufacturer. The order is for Besi’s latest generation system incorporating 100 nm placement accuracy and is scheduled for delivery in Q4-24 and Q1-25. Besi anticipates receiving additional hybrid bonding orders from other customers in Q2-24 as well.

Richard W. Blickman, President and Chief Executive Officer of Besi, commented: “The receipt of this significant order highlights the commitment by a second leading logic manufacturer to adopt hybrid bonding assembly technology for their most advanced data center applications. It also helps confirm the favorable long-term prospects and roadmap anticipated for Besi’s hybrid bonding systems in next generation AI related logic, memory and consumer related computing applications over the next decade.“

To read the full version of our press release, please download the PDF file.

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