Esec 2100 hS iXplus
Introducing the Esec 2100 hS iXplus, the latest innovation in the renowned Esec Die Bonder 2100 i-Family. Engineered for speed and precision, this advanced system sets a new benchmark in die bonding technology.
Unmatched Speed and Quality
The newly introduced continuous epoxy pattern writing technology enables high-speed pattern application without compromising on quality. Combined with the UPH-optimized Ultimate Dispense Vision strategy, the 2100 hS_iXplus_ is the fastest die bonder equipped with a single dispense system on the market today.
Seamless Synchronization
The dispenser’s remarkable capability to keep pace with the proven, yet further optimized, pick-and-place mechanism ensures maximum throughput and operational efficiency.
Highly Scalable and Flexible
Built on the trusted platform of the 2100 i-Family, the 2100 hS_iXplus_ offers extensive scalability through a wide range of available options, allowing you to tailor the system to your specific production needs.
Best-in-Class Cost of Ownership
Once again, Besi delivers a high-speed die bonder that not only excels in performance but also offers the best possible cost of ownership (CoO), ensuring long-term value and reliability.
Elevate your die bonding process with the Esec 2100 hS iXplus - where speed meets precision and efficiency.
More information
Seeing is believing, so we are more than happy to give you a demonstration on a live system. Contact us today for more information.
Key Features
Fastest Single Dispensing System
- New continues epoxy writing allowing high quality patterns at maximum writing speed
- Pattern integrated fast and reliable epoxy tailing prevention
- New ultimate fast vision process strategy
- Improved writing axes design
- The only Single Dispense System able to catch up with all P&P speeds
Optimized Pick & Place and Strip Transport
- Automatic Recipe optimization to maximize Bond UPH
- Enhanced Liquid Cooling System for even higher speed
- Speed optimized Pick & Place trajectory
- Intelligent speed optimized soft pick and bond modes
- Proven “light & rigid” P&P design
- Precision finished strip handler for most sensitive strips
- Reliable and save strip push out to magazine by clamp
Generation 5 Technology
- High performance 4-megapixel Vision System
- Up to three calibrated Dual Color Illuminations per camera
- Generation 5 Hardware Link (Gigabit Ethernet /GinLink)
- Latest high performance 8 core industrial PC
- State of the art User Interface including multiple camera inspection images and viewers
Scalable i-Family machine
The Esec 2100 hS iXplus can be scaled up or upgraded with 2100 i-machine family features, including:
- AI supported low contrast Epoxy Pattern detection
- Up looking Vision System
- High Precision Bond Head
- Pick Strip from Box capability
- Device Height Measurement System
- Epoxy Volume Measurement and Control
Specifications
Die Placement Accuracy Epoxy Process
- ≥2 mm: 12 μm / 0.2° (3σ) (in accuracy mode)
- ≥2 mm: 18 μm / 0.2° (3σ) (standard mode)
- ≥2 mm: 20 μm / 0.2° (3σ) (in high speed mode)
- MTBF: >200 h
Productivity
- Up to 20,000 UPH
Bond Process
- Bond force: 0.2 - 20 N
- Bond rotation: 360°
- Bond heating: programmable, max. 200°C
Substrate Dimensions
- Width: 23 - 102 mm
- Length: 90 - 300 mm
- Thickness: 0.1 - 2.5mm
Wafer and Die Dimensions
- Wafer size: 4” - 12”
- Frame size: 6” - 12”
- Die size: 0.5 - 20 mm
- Die thickness: > 0.075 mm
Machine Dimensions
- Footprint: W x D x H: 1,785 x 1,448 x 1,400mm
- Weight: approx. 1,400kg / 3,000 lb
Options
Substrate Handler
- Dual Input Handler (TOS with MHIN)
- Dual Input Handler for Pick Strip from Box (DINPU)
- Magazine Handler Input (MHIN only)
- Rail Downholder
- Pneumatic Downholder Disp/Bond
- Strip Marking Unit
- Strip Handler 100 mm cold Rail
- Precision Finished Strip Handler 100 mm hot taped QFN
- SMEMA Link Input
- SMEMA Link Output
Dispenser
- AI Epoxy Shape Check
- Dual Dispenser
- Dual Dispenser with Device Height Measurement
- Epoxy Volume Measurement (EVM)
Pick & Place
- Liquid Cooling System
- Up Looking Vision – Medium FoV
- Beam Die Sensor
- High Precision Bond Head
- Dual Stage Die Ejector
Vision (All Illumination systems with 2 colors)
- Dispense Indirect Illumination
- Dispense Vertical Indirect Illumination
- Disp. Vertical Indirect Illum. Polarized
- Bond Indirect Illumination
- Bond Vertical Indirect Illumination
- Bond Vertical Indirect Illum. Polarized
Automation
- Wafer Mapping including Conversion
- E142 Strip Mapping
- Transfer Logging
- Material Tracking
Miscellaneous
- Uninterruptible Power Supply to PC
- Ionizer-Controlled Pick
- Ionizer-Controlled Bond
- Ionizer-Controlled Dispense
- Ionizer-Controlled Wafer Load Top
- Ionizer-Controlled Wafer Load Bottom
- Ionizer-Controlled Magazine Input
- Fine Filter Unit
- Fine Filter Unit with Air Particle Sensor
