Besi is proud to participate in the Hybrid Bonding Symposium 2026, taking place at the SEMI Headquarters in Milpitas, California, on January 22-23, 2026. This event brings together leading experts to explore the latest developments in hybrid bonding technology, a key driver for advanced semiconductor packaging.

Besi’s presentation, “D2W Hybrid Bonding: An Equipment Supplier Perspective,” will provide valuable insights into equipment innovations and challenges from a supplier’s viewpoint.

Join us for technical sessions, keynote talks, panel discussions, and networking opportunities with industry leaders. For more information, visit the official symposium website at https://attend.ieee.org/hbs/

Semi Headquarters, Milpitas California

January 22-23, 2026

Title of talk: D2W Hybrid Bonding: An Equipment Supplier Perspective