Besi is excited to participate in the Wafer Level Packaging Symposium 2026, taking place in San Francisco from February 17-19. This event brings together industry experts to discuss the latest trends and technologies in wafer-level packaging.

Don’t miss the keynote presentation, “Scaling Interconnects Below 10 µm with Hybrid Bonding and Fluxless TCB”, which will highlight breakthrough advancements in interconnect scaling and bonding techniques essential for next-generation semiconductor devices.

Be sure to visit the symposium to discover our innovative equipment solutions designed to meet the evolving demands of wafer-level packaging and hybrid bonding.

For more information and registration details, please visit: https://smta.org/mpage/wafer

San Francisco

February 17-19, 2026