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Press Releases

06 Jul 2016

BE Semiconductor Industries to Host Advanced Packaging Technology Symposium at SEMICON West

Duiven, the Netherlands, July 6, 2016 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY, Nasdaq International Designation), a leading manufacturer of assembly equipment for the semiconductor industry, will host an Advanced Packaging Technology Symposium during the SEMICON West tradeshow on Wednesday July 13, 2016, from 1.00 p.m. till 5.00 p.m. at the Moscone Convention Center, South Hall, room 309.

Industry experts and Besi senior management will discuss topics in wafer level packaging, 2.5D and 3D packaging, EMI shielding (sputtering) and power package technology (sintering).

A detailed agenda can be found at our website:

Attendees can register for the technical seminar by sending an email to:

To read the full version of our press release, please read the PDF file.

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