Press Releases06 Jul 2016
BE Semiconductor Industries to Host Advanced Packaging Technology Symposium at SEMICON West
Industry experts and Besi senior management will discuss topics in wafer level packaging, 2.5D and 3D packaging, EMI shielding (sputtering) and power package technology (sintering).
A detailed agenda can be found at our website: www.besi.com.
Attendees can register for the technical seminar by sending an email to: firstname.lastname@example.org.
To read the full version of our press release, please read the PDF file.