Duiven, the Netherlands, July 3, 2018 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY, Nasdaq International Designation), a leading manufacturer of assembly equipment for the semiconductor industry, today announced that based on a preliminary review, its Q2-18 sequential revenue growth is expected to be below its previously reported guidance range due to the cancellation at quarter end of € 28 million of die bonding orders previously expected for shipment during the quarter. The orders were by a single customer for high end smart phone applications. Such shortfall was partially offset by higher than anticipated shipments for end user market applications such as computing, automotive and other mobile devices. As a result, Besi now expects that its Q2-18 revenue will increase by approximately 4% vs. the € 154.9 million reported in Q1-18. Previously, Besi guided for a sequential revenue increase of approximately +10 - +15% (€ 170.4 - € 178.1 million range) vs. Q1-18. In addition, based on preliminary estimates, Besi forecasts that its H1-18 revenue will increase over H1-17 by 13%.
Of note, there are no changes to Besi's prior guidance for Q2-18 and H1-18 gross margin and operating expense development based on the lower Q2-18 revenue growth forecast.
Complete financial results for Q2-18 and H1-18 will be reported on July 26, 2018.
To read the complete version of our press release, please download the PDF file.