Richard W. Blickman, President and Chief Executive Officer of Besi, commented:
“Besi management conducted a detailed strategic plan review in conjunction with key customers and other stakeholders in March of this year. The review highlighted the expanded deployment of AI technologies in data center, edge computing and consumer applications through 2030. It also highlighted the accelerated adoption of 2.5D and 3D chiplet-based, wafer level assembly structures in our principal end user markets as data volumes increase significantly while Moore’s Law slows. This, in turn, should drive higher expected demand for Besi’s advanced packaging solutions for both logic and memory applications.

Accordingly, we are raising Besi’s long-term target revenue forecast including forecasts for our sub micron die attach systems and AI related mainstream die attach systems which account for a significant portion of our increased revenue, gross margin and operating margin targets.”

Investor Day Target Model Summary

                                        2024 Investor Day                 2025 Investor Day
Revenue                        € 1 billion+++                          € 1.5 – € 1.9 billion
Gross margin               62-66%                                    64-68%
Operating margin        35-50%                                    40-55%

Webcast and presentations
The Investor Day presentations and Q&A are scheduled to begin at 1:00 pm CET and conclude at approximately 4.00 pm CET. A link to the live webcast can be found on our website at www.besi.com. The presentation and a replay will be made available on the website following the event.

To read the full version of our press release, please download the PDF file.