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Datacon 8800 TC advanced

Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications.

The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and complete new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications.

The Datacon 8800 TC advanced:

  • Ultra Fine Pitch Capability
  • Enhanced Thermo Compression Bond Control
  • 7-Axis Bond Head
  • Highest Productivity on Smallest Footprint

Key Features

Next Generation Control Platform

  • New motion control - New hardware & software
  • Enhanced trajectory control - Reduced latency times
  • More computing power - Process variable tracing

7-Axis / 250N Bond Head

  • 3 Actuators for positioning - X, Y, Theta
  • 2 Axes for bond control - Z, W
  • 2 Actuators for auto tilt setup - A, B

Advanced TC-CUF Yield Control

  • Yield and down-time prevention caused by flux
  • Trajectory controlled heating and cooling
  • New thermal stress resistant tool holder - Tilt
  • Accurate temperature calibration station

Optimized Tool Holder & Tool Hardware

  • New tool holder design - Special improved electrical contact mechanism
  • Fast maintenance
  • New tool design - Improved heater temperature accuracy and optimized electrical contact material

Integrated Monitoring & Alarming

  • Alarm window setup for any process variable
  • Process variable monitoring against defined alarm window
  • Escaping alarm window generates machine stop and alarm
  • Monitoring results available via SECS/GEM

Temperature Calibration Station

  • Enhanced tool to tool repeatability
  • In-situ temperature check - 20 to 240 °C within ±1 °C
  • Portable sensor - Move from machine to machine

Tool to Tool Repeatability

  • Recipe portability
  • Separation of machine and recipe parameters
  • Auto calibration - Consistantly calibrated tools
  • Portable alarm windows



X/Y placement accuracy ± 2 µm @ 3 sigma
Accuracy self check Single BMC kit
Output up to 1,000 UPH
Number of bond heads 2
7-axis TC bond head -4° - 4° rotation
Tool heating up to 420 °C
Ramping speed + 200 °C/s (Heating)
- 100 °C/s (Cooling)
Temperature uniformity ± 5 °C
Interface temperature monitoring Integrated measurement
Bond force 3 - 250 N (full UPH)
Bond control Force / Height / Both combined
Tool flatness ± 1 µm
Co-planarity ± 2 µm @ 10 mm
Co-planarity set-up Automatic
Footprint 1,600 x 1,200 x 1,880mm (with dual monitor)
Uptime > 95%


Substrate & Carriers

C2S - Strips max. 260 x 125 mm
C2S - Boats/Carriers max. 260 x 125 mm
C2W - Wafers max. 12" (300 mm)
C2W - Loading Manual / FOUP on request (option)
Substrate heating max. 200 °C ± 2.5%



Die size 2 - 16 mm
Die thickness 50µm - 3mm, thinner on request
Wafer size 8" - 12" (200 - 300 mm)
Frame size 9" - 15" (125 - 375 mm)


Multi-chip Capability

Teaching Camera view
Multi-chip modes Stacked die or Side-by-side
Wafer change Automatic (up to 25 types per cassette)
Pick & Place tool change Manual
Ejector tool change Automatic (up to 3 sizes)
Bond profiles Individual bond profiles per stack layer


Component Handling

Flip chip unit Pick-up of the component from wafer, 180° rotation of the flip arm and presentation to the bond head
Wafer pre-rotation 0° - 280°
Slide fluxer Optional
Cassettes 1
Cassette size up to 25 film frames per cassette


Substrate Handling

Substrate & carrier transport Gripper based with vacuum cups
Wafer transport Robot handling (from dual FOUP port on request)
I/O buffer Flat belt system, inline (SMEMA) or stand-alone possible
I/O Elevator type Programmable lift systems for one magazine
I/O Magazine size Various (on request)


Tool system

Bond tools Integrated heater / cooler and temperature sensor
Single chip ejector For one configured ejector tool
Multi chip ejector Automatic quick changing carousel system, max. 3 ejector tools


Vision system

Field of View Wafer camera: 12 x 12 mm 
Substrate camera: 2.0 x 1.6 mm
Up-looking camera: 2.0 x 1.6 mm
Illumination Programmable RGB lighting (4 different colors)
Image recognition methods Circle search, edge search, bump search, feature matching, structure search, epoxy inspection, contour inspection, datamatrix recognition, ...


Computer and MMI system

Operating system Linux
User interface (GUI) User-friendly graphical user interface with pull-down menus
Monitor 2x 19" flat screen
Data storage HDD, USB
Data transfer FTP via TCP/IP network, SECS/GEM
Interface SMEMA 1.2, SECS-II (GEM compliant)


Standard software

Features Post -bond inspection, Z-positional bonding, Auto-calibration
Programming wizards Step-by-step guided programming with graphical support for e.g. product, substrate, component, epoxy



Flux Application

  • Flux film thickness: Cavity plates from 5 μm – 200 μm
  • Viscosity range: 2,800 cps – 110,000 cps


  • Open platform architecture for full customization


  • Single component tracking
  • Wafer mapping
  • Barcode scanner
  • Data matrix recognition
  • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142)
  • Pseudo X-Ray
  • Flip and P&P Tool Inspection
  • Needle Hole Inspection
  • Eject Tool Needle Inspection
  • Eject Tool Cap Inspection
  • Ejection System Live Cam
  • SECS GEM Parameter Provider
  • Wafermap Verification by Border Component
  • Configure User Level
  • Advanced Flux Imprint Check
  • Chipping Inspection
  • Auto Illumination
  • Distributed Bonding
  • Lot Management
  • Complete bonding
  • Custom Slow Travel speed /distance
  • Measure component spacing
  • Individual bond position offsets
  • Fluxlevel detection
  • Parameter provider
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