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Datacon 8800 TC advanced

Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications.

The Datacon 8800 TCadvanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and complete new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TCadvanced is the essential tool of reference of current TSV applications.

The Datacon 8800 TC advanced:

  • Ultra Fine Pitch Capability
  • Enhanced Thermo Compression Bond Control
  • 7-Axis Bond Head
  • Highest Productivity on Smallest Footprint

Key Features

Next Generation Control Platform

  • New motion control - New hardware & software
  • Enhanced trajectory control - Reduced latency times
  • More computing power - Process variable tracing

7-Axis / 250N Bond Head

  • 3 Actuators for positioning - X, Y, Theta
  • 2 Axes for bond control - Z, W
  • 2 Actuators for auto tilt setup - A, B

Advanced TC-CUF Yield Control

  • Yield and down-time prevention caused by flux
  • Trajectory controlled heating and cooling
  • New thermal stress resistant tool holder - Tilt
  • Accurate temperature calibration station

Optimized Tool Holder & Tool Hardware

  • New tool holder design - Special improved electrical contact mechanism
  • Fast maintenance
  • New tool design - Improved heater temperature accuracy and optimized electrical contact material

Integrated Monitoring & Alarming

  • Alarm window setup for any process variable
  • Process variable monitoring against defined alarm window
  • Escaping alarm window generates machine stop and alarm
  • Monitoring results available via SECS/GEM

Temperature Calibration Station

  • Enhanced tool to tool repeatability
  • In-situ temperature check - 20 to 240 °C within ±1 °C
  • Portable sensor - Move from machine to machine

Tool to Tool Repeatability

  • Recipe portability
  • Separation of machine and recipe parameters
  • Auto calibration - Consistantly calibrated tools
  • Portable alarm windows



X/Y placement accuracy± 2 µm @ 3 sigma
Accuracy self checkSingle BMC kit
Outputup to 1,000 UPH
Number of bond heads2
7-axis TC bond head-4° - 4° rotation
Tool heatingup to 420 °C
Ramping speed+ 200 °C/s (Heating)
- 100 °C/s (Cooling)
Temperature uniformity± 5 °C
Interface temperature monitoringIntegrated measurement
Bond force3 - 250 N (full UPH)
Bond controlForce / Height / Both combined
Tool flatness± 1 µm
Co-planarity± 2 µm @ 10 mm
Co-planarity set-upAutomatic
Footprint1,600 x 1,200 x 1,880mm (with dual monitor)
Uptime> 95%


Substrate & Carriers

C2S - Stripsmax. 260 x 125 mm
C2S - Boats/Carriersmax. 260 x 125 mm
C2W - Wafersmax. 12" (300 mm)
C2W - LoadingManual / FOUP on request (option)
Substrate heatingmax. 200 °C ± 2.5%



Die size2 - 16 mm
Die thickness50µm - 3mm, thinner on request
Wafer size8" - 12" (200 - 300 mm)
Frame size9" - 15" (125 - 375 mm)


Multi-chip Capability

TeachingCamera view
Multi-chip modesStacked die or Side-by-side
Wafer changeAutomatic (up to 25 types per cassette)
Pick & Place tool changeManual
Ejector tool changeAutomatic (up to 3 sizes)
Bond profilesIndividual bond profiles per stack layer


Component Handling

Flip chip unitPick-up of the component from wafer, 180° rotation of the flip arm and presentation to the bond head
Wafer pre-rotation0° - 280°
Slide fluxerOptional
Cassette sizeup to 25 film frames per cassette


Substrate Handling

Substrate & carrier transportGripper based with vacuum cups
Wafer transportRobot handling (from dual FOUP port on request)
I/O bufferFlat belt system, inline (SMEMA) or stand-alone possible
I/O Elevator typeProgrammable lift systems for one magazine
I/O Magazine sizeVarious (on request)


Tool system

Bond toolsIntegrated heater / cooler and temperature sensor
Single chip ejectorFor one configured ejector tool
Multi chip ejectorAutomatic quick changing carousel system, max. 3 ejector tools


Vision system

Field of ViewWafer camera: 12 x 12 mm 
Substrate camera: 2.0 x 1.6 mm
Up-looking camera: 2.0 x 1.6 mm
IlluminationProgrammable RGB lighting (4 different colors)
Image recognition methodsCircle search, edge search, bump search, feature matching, structure search, epoxy inspection, contour inspection, datamatrix recognition, ...


Computer and MMI system

Operating systemLinux
User interface (GUI)User-friendly graphical user interface with pull-down menus
Monitor2x 19" flat screen
Data storageHDD, USB
Data transferFTP via TCP/IP network, SECS/GEM
InterfaceSMEMA 1.2, SECS-II (GEM compliant)


Standard software

FeaturesPost -bond inspection, Z-positional bonding, Auto-calibration
Programming wizardsStep-by-step guided programming with graphical support for e.g. product, substrate, component, epoxy



Flux Application

  • Flux film thickness: Cavity plates from 5 μm – 200 μm
  • Viscosity range: 2,800 cps – 110,000 cps


  • Open platform architecture for full customization


  • Single component tracking
  • Wafer mapping
  • Barcode scanner
  • Data matrix recognition
  • Substrate/Strip/TU-Mapping (Semi S12, S14 in G84 and E142)
  • Pseudo X-Ray
  • Flip and P&P Tool Inspection
  • Needle Hole Inspection
  • Eject Tool Needle Inspection
  • Eject Tool Cap Inspection
  • Ejection System Live Cam
  • SECS GEM Parameter Provider
  • Wafermap Verification by Border Component
  • Configure User Level
  • Advanced Flux Imprint Check
  • Chipping Inspection
  • Auto Illumination
  • Distributed Bonding
  • Lot Management
  • Complete bonding
  • Custom Slow Travel speed /distance
  • Measure component spacing
  • Individual bond position offsets
  • Fluxlevel detection
  • Parameter provider
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