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Events & Shows

29 Sep 2025 - 02 Oct 2025

IMAPS Symposium 2025

Tomorrow’s semiconductor breakthroughs demand smarter, faster, and more efficient packaging solutions. At IMAPS 2025, Besi is unveiling the next generation of assembly and packaging technologies, built to meet the needs of AI, HPC, and heterogeneous integration. Visit us at booth no. 706 to learn more about our innovative solutions.

As microelectronics and advanced packaging continue to evolve, staying ahead requires cutting-edge solutions in heterogeneous integration, high-performance computing (HPC), AI, and next-gen interconnect technologies. At IMAPS 2025, Besi will present our latest innovations in die attach, packaging, and plating & cleaning equipment, designed to push the limits of precision, efficiency, and scalability. Visit us at booth no. 706.

Join us to explore:

  • Advanced Package Structures
    Solutions for heterogeneous integration, HPC, and AI applications.

  • Next-Generation Interconnects
    Innovations in bumping, wirebonding, and advanced interconnect technologies.

  • Materials & Equipment
    Enabling technologies that enhance reliability and performance in semiconductor packaging.
      

San Diego, California, USA | September 29 - October 2, 2025 | Booth #706

https://imaps.org/page/IMAPS2025

Visit our booth to discuss how Besi can help you tackle the next generation of packaging challenges!

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