AI and smart devices are driving an unprecedented wave of innovation, pushing the limits of advanced packaging and semiconductor manufacturing. At SEMICON Korea 2026, Besi will showcase the next generation of Thermo Compression Bonding Equipment, designed to deliver unmatched precision, scalability, and efficiency for cutting-edge semiconductor applications.

Join us to explore how our latest solutions are shaping the future of heterogeneous integration, fan-out, wafer-level, and flip-chip packaging, helping you stay ahead in this era of rapid technological evolution.

Visit booth D322 to connect with our experts and see the future of bonding technology in action!

https://www.semiconkorea.org/en

Seoul, South Korea | SEMICON Korea 2026 | Booth D322