Peter Wiedner, Besi’s Senior Vice President Sub-Micron Die Attach, commented:
“We are pleased with the further market acceptance of our new TCB Next die to wafer thermo compression bonding system. This important follow on order confirms our position as a leading player in this rapidly evolving market. It also highlights the dual track approach pursued by many manufacturers considering both advanced TCB and hybrid bonding process technologies for current wafer level assembly applications.”

To read the full version of our press release, please download the PDF file.