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25 Jul 2024

BE Semiconductor Industries N.V. Announces Q2-24 Results

Q2-24 Revenue of € 151.2 Million and Net Income of € 41.9 Million. Orders of € 185.2 Million Up 64.5% vs. Q2-23.H1-24 Revenue and Net Income of € 297.5 million and € 75.9 Million, Respectively. Orders of € 313.0 Million Up 22.9% vs. H1-23.

Duiven, the Netherlands, July 25, 2024 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the second quarter and first half year ended June 30, 2024.


Key Highlights Q2-24

  • Revenue of € 151.2 million up 3.3% vs. Q1-24 due primarily to higher shipments for photonics and 2.5D assembly applications. Down 7.0% vs. Q2-23 principally due to continued weakness in smartphone end markets partially offset by growth in hybrid bonding and other advanced packaging applications

  • Orders of € 185.2 million up 45.0% vs. Q1-24 and 64.5% versus Q2-23 principally due to significant growth in hybrid bonding, photonics and 2.5D assembly solutions for AI applications partially offset by ongoing weakness in automotive end markets

  • Gross margin of 65.0% decreased by 2.2 points vs. Q1-24 and by 0.6 points vs. Q2-23 due primarily to product mix

  • Net income of € 41.9 million increased 23.2% vs. Q1-24 primarily due to a € 10.0 million decrease in share-based compensation. Vs. Q2-23, net income decreased 20.3% due principally to lower revenue and increased R&D spending in support of wafer level assembly activities. Q2-24 net margin rose to 27.7% vs. 23.2% in Q1-24 but declined versus the 32.4% reported in Q2-23

  • Net cash of € 74.4 million at quarter end was flat compared to Q2-23 and reflected the payment of € 171.5 million in dividends and the conversion into equity of € 89.9 million of Convertible Notes in Q2-24


Key Highlights H1-24

  • Revenue of € 297.5 million increased 0.5% vs. H1-23 principally due to higher demand for hybrid bonding and other AI-related advanced packaging systems offset by lower revenue for high-end mobile applications

  • Orders of € 313.0 million up 22.9% vs. H1-23 due to increased demand for hybrid bonding, photonics and 2.5D assembly solutions partially offset by lower bookings for automotive and mobile applications

  • Gross margin of 66.1% increased by 1.1 point versus H1-23

  • Net income of € 75.9 million decreased € 11.2 million, or 12.9%, vs. H1-23 primarily due to € 9.1 million higher share-based compensation and € 7.1 million higher R&D spending. Similarly, net margin decreased to 25.5% versus 29.5% in H1-23


Q3-24 Outlook

  • Revenue expected to be flat (plus or minus 5%) vs. € 151.2 million reported in Q2-24

  • Gross margin expected to range between 64-66% vs. 65.0% realized in Q2-24

  • Operating expenses expected to decrease 0-5% vs. € 49.0 million in Q2-24


To read the full version of our press release, please download the PDF file.

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