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22 Oct 2015

Besi Reports Net Income of € 6.3 Million and € 39.3 Million for Q3-15 and YTD-15, Respectively. Net Cash Position Expands to € 109.0 Million. Backlog Indicates Q4-15 Revenue Comparable to Q3-15

Duiven, the Netherlands, October 22, 2015 - BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTCQX: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the third quarter and first nine months ended September 30, 2015.

Key Highlights Q3-15

  • Revenue of € 72.1 million, down 30.9% and 30.3% vs. Q2-15 and Q3-14 due primarily to lower demand for die attach and molding systems for smart phone, tablet and mainstream electronics applications and customer push outs to subsequent quarters due to industry downturn
  • Orders of € 74.9 million down 18.5% vs. Q2-15 and 17.6% vs. Q3-14 due to lower orders for advanced packaging and automotive applications partially offset by growth in TCB and die sorting bookings for high end cloud server applications as well as higher singulation and solar plating orders
  • Gross margins of 48.7% increased vs. 47.9% in Q2-15 and 45.3% in Q3-14 and exceeded guidance due primarily to material cost efficiencies from Asian supply chain and personnel transfer and forex benefits
  • Operating expenses down by € 3.3 million (10.3%) sequentially and better than guidance
  • Net income of € 6.3 million declined vs. € 15.5 million in Q2-15 and € 21.5 million in Q3-14 but was higher than expected due to better gross margin and operating expense development
  • Net cash increased by € 22.9 million (+26.6%) year over year to reach € 109.0 million
  • Share buyback program commenced to enhance shareholder value


Key Highlights YTD-15/YTD-14

  • Revenue of € 271.4 million down 6.3% vs. YTD-14 due to reduced demand for smart phones and mainstream electronics partially offset by growth in high end cloud server and solar applications
  • Orders of € 271.0 million down 16.9% primarily due to lower bookings by Asian subcontractors for flip chip and multi module die attach and ultra-thin molding equipment for smart phone and other advanced packaging applications. Partially offset by significant growth in TCB and die sorting orders
  • Gross margins increased to 48.5% vs. 43.8% in YTD-14 due primarily to material cost efficiencies and forex gains
  • Net income of € 39.3 million down € 12.1 million vs YTD-14. Net margin of 14.5% vs. 17.7% YTD-14



  • Q4-15 revenue expected to be within a range of +10% to -10% vs. Q3-15 levels. Continued strong cash flow generation forecast


To read the full version of our press release, please download the PDF file.

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